FB400
Minova’s FB400 range are high‑strength, thixotropic anchoring grouts for top‑down cable bolting and long tendons, offering non‑shrink expansion and excellent pumpability.
Product Benefits
Sectors
Applications
Product Details
FB400 is Minova’s proven family of high‑strength, thixotropic anchoring grouts engineered for top‑down cable bolting, long tendon grouting and consolidation in hard and soft rock. Each variant is supplied as a ready‑to‑use, free‑flowing blended cementitious powder requiring only water and a high‑shear mixer, delivering consistent quality underground. All three formulations – FB400, FB400C and FB400+ commbine rapid early strength with a non‑shrink expansion system that helps ensure complete annulus contact and durable long‑term performance. Typical compressive strengths (28 days) range up to 85 MPa depending on mix water and product. FB400+ is designed for long‑distance placement and is pumpable to 100 metres, unlocking remote headings without frequent pump relocations. FB400C adds a migrating corrosion inhibitor for enhanced protection in aggressive groundwater while retaining the same high‑performance rheology. At a practical level, the range offers a generous 120‑minute pumping life with a typical set time of 420 minutes and predictable yields of approximately 15 litres per 20 kg bag, supporting safe, controlled installations.
Product Features
FB400 thixotropic grouts delivering safer, faster cable bolting
Thixotropic stability for broken ground consolidation
High early and ultimate strength for dependable hold
Non‑shrink expansion for complete annulus contact
Corrosion‑inhibitor option for aggressive groundwater
Long pump life and controlled set for safe installs
Product variants & Applications
FB400
High‑strength, thixotropic anchoring grout delivering fast, secure cable bolt encapsulation underground
FB400+
Enhanced corrosion protection with thixotropic strength—engineered for aggressive water and long‑term bolt life
FB400C
Long‑reach pumping up to 100m for remote headings, with rapid strength and non‑shrink encapsulation
